Silicon carbide (SiC) is one of the most versatile and high-performance industrial materials in the world. Known for its exceptional hardness, thermal stability, and chemical resistance, it serves a broad range of applications from abrasive blasting to power electronics. This article explores the different types of silicon carbide and matches each to its corresponding grit size or physical form, giving B2B buyers and industrial professionals actionable insights.
Black silicon carbide contains about 95% SiC and is known for its high hardness and mechanical strength. It is widely used in grinding, cutting, and refractory applications.
Mohs hardness: ~9.2
Good thermal conductivity
Moderate purity
Abrasive tools
Deoxidizing agents
Refractory bricks
FEPA F series: F12 – F220 (macro grains), F240 – F1200 (micro powder)
FEPA P series: P16 – P2500
Green silicon carbide is a purer form (≥99% SiC) with slightly higher hardness than black SiC. It's typically used in high-precision grinding and polishing.
Mohs hardness: ~9.4
Very high purity
Chemically inert
Hard alloy finishing
Semiconductor wafer slicing
Optical polishing
FEPA F series: F12 – F220, F240 – F2000
FEPA P series: P400 – P6000
3C-SiC has a cubic crystal structure and is used primarily in the semiconductor industry due to its high electron mobility.
Low defect density
High thermal conductivity
Thin-film friendly
High-temperature semiconductors
MEMS
Substrates for GaN devices
Sold as wafers, thin films or epitaxial layers
Not applicable to FEPA grit sizing
These are polytypes with hexagonal crystal structures widely used in power electronic devices due to superior electron mobility and breakdown strength.
MOSFETs
Schottky diodes
Power modules
Available as mono-crystalline wafers (e.g. 100mm, 150mm)
No applicable grit sizes
RS-SiC is a ceramic composite formed by infiltrating silicon into carbon preforms. It combines high strength with excellent oxidation resistance.
Heat exchangers
Burner nozzles
High-speed train braking systems
F36 – F90 (when used as matrix or base material)
Typically delivered as pre-shaped components
HP-SiC is produced by sintering SiC powders under high pressure and temperature. It offers excellent strength and chemical resistance.
High-temperature structural components
Satellite optics
Furnace furniture
F90 – F400 (if raw powder required)
Primarily sold as solid blocks or custom parts
CO-SiC is made by adding oxide binders to SiC grains, forming a porous structure suitable for kiln furniture and refractory linings.
Kiln shelves
Burner blocks
Support beams
F12 – F90 (for shaping or as base grains)
Type | Grit Sizes / Form | Notes |
---|---|---|
Black SiC | F12–F220, F240–F1200, P16–P2500 | Common for abrasives and refractories |
Green SiC | F12–F220, F240–F2000, P400–P6000 | High-precision polishing and cutting |
3C-SiC (β-SiC) | Thin film, wafers | Semiconductor applications only |
4H/6H-SiC | Single crystal wafers | Power electronics, not gritted |
RS-SiC | F36–F90 (optional) | Structural use, mainly in solid forms |
HP-SiC | F90–F400 (optional) | High-end ceramics, also in block forms |
CO-SiC | F12–F90 | For refractory and kiln use |
Understanding the types of silicon carbide and their available grit sizes helps procurement teams, engineers, and end users select the right material for each application—whether you're sourcing abrasive grits or high-tech wafers.
For bulk orders or detailed specs on each grade, contact a certified silicon carbide supplier and request batch-specific technical data sheets (TDS).
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