Carborundum (Silicon Carbide): Properties, Selection, and Procurement Guide

Carborundum (Silicon Carbide, SiC): Quick Answer

Carborundum is the trade/common name for silicon carbide (SiC), an ultra-hard ceramic (Mohs ≈ 9.2–9.5) used as abrasive grain (grinding wheels, coated abrasives, blasting), refractory aggregate, and advanced ceramics/semiconductors. It features high thermal conductivity, chemical inertness, and stability at high temperatures. Industrial SiC is typically produced by the Acheson process (quartz + carbon, electric resistance furnace) and supplied as black SiC (tougher, for general grinding/blasting) or green SiC (sharper, higher purity, for hard/brittle materials).

  • Use it when: Need aggressive cutting/long life on hard metals, ceramics, glass/stone, or as refractory/phosphor/ceramic feedstock.
  • Choose black vs green: Black = toughness/value; Green = sharpness/purity/fine lapping.
  • Key specs: FEPA/JIS grit, purity (%SiC), PSD (D10/D50/D90), magnetic content, bulk density, washing (acid/water), shape.

What Is Carborundum?

Carborundum is the historical/industrial name for silicon carbide (SiC), discovered in the late 19th century and commercialized as a synthetic abrasive. Today it spans two major domains: (1) abrasives & refractories (bulk grains, powders) and (2) electronic-grade SiC (single-crystal/polycrystalline for power devices).

In abrasives/refractories, SiC is valued for hardness, sharp edges, thermal conductivity, and chemical stability. Typical product families: Black SiC (tough, value) and Green SiC (higher purity, sharper).

Key Properties & Parameters (incl. 3C/4H/6H Polytypes)

SiC has many polytypes; for engineering selection, 3C-SiC (cubic), 4H-SiC (hexagonal), and 6H-SiC are common references. Abrasive grains are typically polycrystalline with stacked variants; electronics favor 4H/6H wafers for their wide bandgaps.

Parameter Black SiC (Abrasive) Green SiC (Abrasive) 3C-SiC (β-SiC) 4H-SiC 6H-SiC
Mohs Hardness ≈ 9.2–9.5 ≈ 9.3–9.5 ≈ 9.3 ≈ 9.3 ≈ 9.3
Crystal System Polycrystalline Polycrystalline Cubic (zinc blende) Hexagonal Hexagonal
Typical Purity (abrasive grade) ≈ 97–99% SiC ≈ 98.5–99.5% SiC High (electronics R&D) Electronic grade (very high) Electronic grade (very high)
Density (theoretical) ~3.20–3.22 g/cm³ ~3.21–3.22 g/cm³
Thermal Conductivity High (material & grit dependent) High High High
Bandgap (room temp., electronics) ~2.3–2.4 eV ~3.2–3.3 eV ~3.0–3.1 eV
Typical Uses Grinding, blasting, refractories Lapping, precision grinding, glass/ceramics Thin films, MEMS research Power electronics (MOSFETs, diodes) Power electronics, substrates

* Data are representative engineering ranges. For procurement, specify target purity, PSD, and inspection methods.

Manufacturing Routes & Supplied Forms

Manufacturing Routes

  • Acheson Process: Quartz + carbon in electric resistance furnaces → bulk SiC crystal mass → crushed → classified.
  • Reaction-Bonded (RB-SiC): Porous preforms infiltrated with Si → SiC matrix; high stiffness, complex shapes.
  • Sintered SiC (SSiC): Fine powders, pressureless or hot-pressed → high strength, corrosion/thermal shock resistance.
  • CVD/CVI SiC: High-purity coatings or monolithic deposits for optics/severe environments.
  • Electronic-grade SiC: Sublimation growth (PVT) → 4H/6H single crystals; wafering/polishing for devices.

Supplied Forms (Abrasives/Refractories)

  • Macro grits (FEPA F/P series; e.g., F12–F220 / P12–P220)
  • Micro powders (F230–F1200 / P240–P5000; JIS #240–#8000)
  • Refractory aggregates (0–25 mm graded)
  • Washing: water-wash / acid-wash grades;Magnetic-controlled grades

Selection Checklist

  1. Application: grinding/bonded wheel, coated abrasive, blasting, lapping, refractory, ceramic part?
  2. Material to cut: ferrous/non-ferrous, glass/ceramic, stone, hard alloys → choose black vs green & grit range.
  3. Grit standard: FEPA F/P, JIS; nominal grit + PSD (D10/D50/D90) + sieve curve.
  4. Purity: %SiC, free Si/C, total Fe, Ca, Al, magnetic content (ppm).
  5. Shape & friability: blocky vs angular; crushing route affects cutting behavior.
  6. Surface treatment: water/acid wash;binder-compatibility treatments (for wheels/coated).
  7. Regulatory & docs: COA, MSDS, REACH, RoHS; lot traceability.
  8. Logistics: packaging (25 kg bags, jumbo bags), moisture control, palletization, INCOTERMS.

Comparisons & Application Guidance

Material Pros Cons Typical Uses
Black SiC High toughness, value, good for general grinding/blasting Less sharp than green, slightly lower purity Foundry, steelworks, blast media, bonded wheels
Green SiC Higher purity, sharper edges, excels on hard/brittle substrates Higher price, more brittle Glass/ceramics lapping, precision grinding, carbide tools
Aluminum Oxide Tough, widely available, cost-effective Softer; slower on very hard substrates General metal grinding/polishing
CBN Excellent on ferrous alloys; thermal stability Costly; specialized bonds/equipment HSS, bearing steels finishing
Diamond Hardest; fastest cut on hard/brittle non-ferrous Reacts with Fe at high temp; cost Carbide, glass, stone, composites

Rule of thumb: For ferrous metals → Black SiC or CBN; for glass/ceramics/carbide → Green SiC or Diamond.

Procurement & QA Points

  • Specify standard: FEPA/JIS/ANSI;state grit & PSD tolerances, test methods (laser diffraction / sieving).
  • Impurity control: Total Fe, free Si/C, magnetic content; ask for acid-wash when necessary.
  • COA per lot: Purity, PSD curve, bulk density, LOI, moisture, magnetic (ppm).
  • Trial lots → scale: Approve on 100–500 kg before 10–30 t/mo contracts.
  • Packaging & storage: Moisture barrier bags, desiccants, FIFO.

FAQ

Is carborundum the same as silicon carbide?

Yes. “Carborundum” is the traditional industrial name for silicon carbide (SiC).

Black vs Green SiC — which should I choose?

Black for general grinding/blasting and value; Green for high-purity, sharp cutting of hard/brittle materials and fine lapping.

Which grit standard should I order?

Use FEPA F/P or JIS depending on your plant spec. Always define PSD (D10/D50/D90) and acceptable tolerance bands.

What about electronic-grade SiC (4H/6H)?

That refers to single-crystal wafers for power electronics; it’s outside abrasive grades but shares core material physics.

References

  1. Standard references on SiC materials science (textbooks, handbooks) and FEPA/JIS grit standards.
  2. Manufacturers’ COA/QA methods for abrasive SiC macro & micro grades.
  3. Engineering data on 3C/4H/6H polytype properties used in device and materials selection.

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